Semiconductor assembly and test plants buy dies and substrates to build packaged chips.
HSN code 85429000 is classified as Free under India's DGFT ITC(HS) export policy — no export license is required.
This product may be freely exported/imported from India without a license.
HSN Code Details
Parts of electronic integrated circuits and microassemblies, including bare dies, wafers, lead frames and substrates used in chip packaging.
Use cleanroom packaging and lot tracking, and check export controls on advanced wafers and dies. Semiconductors ship in anti-static trays, tubes or tape and reel with moisture barrier bags and humidity cards; state part number, package, lot and date code, provide RoHS, REACH and origin documents, and check export controls (Wassenaar) on advanced processors and devices.
Related HSN Codes (Heading 8542)
- 8542for the purposes of providing power supply or power control. Lightemitting diode (LED) modules do not have a cap designed to allow easy installation or replacement in a luminaire and ensure mechanical and electrical contact. (b) "Light-emitting diode (LED) lamps" which are electrical light sources cFree
- 85423100Electronic integrated circuits : -- Processors and controllers, whether orFree
- 85423200Electronic integrated circuitsFree
- 85423300Electronic integrated circuitsFree
- 85423900Electronic integrated circuits : -- Other 41/Free
Frequently Asked Questions
No. HSN 85429000 is classified as Free under DGFT ITC(HS) policy, so it can be exported from India without an export license or permit.
They are parts of integrated circuits such as dies and substrates.
HSN 85429000 falls under Chapter 85 and Heading 8542 of India's customs tariff schedule.
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